Epoxy for laser diode die attach
Low outgassing, low-temperature curing, and the ability to determine the presence of curing based on color after curing!
- An insulating epoxy that combines high heat dissipation and low curing shrinkage. - Good adhesion to non-ferrous metals such as aluminum, copper, and nickel. - Low outgassing minimizes contamination of LD. - Can cure at low temperatures (80°C). - Uses boron nitride filler for high thermal conductivity. - Curing status can be confirmed (before curing: off-white, after curing: amber). - Both two-component (room temperature storage) and one-component (frozen storage) options are available.
- 企業：理経
- 価格：Other
